22.08.2016, 13:58 UTC
(19.08.2016, 23:07 UTC)Goliat napisał(a): Do Profesora Palina:
DRIVE STRENGTHENING (GRADE 1) x3
COST
MICROMATERIAL:1x Carbon
DRIVE STRENGTHENING (GRADE 2) x3
COST
MICROMATERIAL:1x Heat Conduction Wiring
MICROMATERIAL:1x Vanadium
COMMODITY:1x Osmium
DRIVE STRENGTHENING (GRADE 3) x3
COST
MICROMATERIAL:1x Heat Conduction Wiring
MICROMATERIAL:1x Vanadium
MICROMATERIAL:1x Shielding Sensors
COMMODITY:1x CMM Composite
DRIVE STRENGTHENING (GRADE 4) x3
COST
MICROMATERIAL:1x Heat Dispersion Plate
MICROMATERIAL:1x High Density Composites
MICROMATERIAL:1x Compound Shielding
COMMODITY:1x CMM Composite
MICROMATERIAL:
3x Carbon
6x Heat Conduction Wiring
6x Vanadium
3x Shielding Sensors
3x Heat Dispersion Plate
3x High Density Composites
3x Compound Shielding
COMMODITY:
6x CMM Composite
3x Osmium
Dzięki +rep, przypinam, sorki, że dopiero teraz, ale mam ostatnio za dużo na głowie